1. 2. 3. material content data sheet sales product name saf-xc878-13ffi 5v ac issued 29. august 2013 ma# MA000941200 package pg-lqfp-64-5 weight* 374.09 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 10.632 2.84 2.84 28420 28420 leadframe non noble metal magnesium 7439-95-4 0.172 0.05 459 inorganic material silicon 7440-21-3 0.743 0.20 1987 non noble metal nickel 7440-02-0 3.431 0.92 9171 non noble metal copper 7440-50-8 110.016 29.41 30.58 294092 305709 wire noble metal gold 7440-57-5 2.078 0.56 0.56 5554 5554 encapsulation organic material carbon black 1333-86-4 1.194 0.32 3191 plastics epoxy resin - 32.228 8.62 86153 inorganic material silicondioxide 60676-86-0 205.307 54.87 63.81 548824 638168 leadfinish non noble metal tin 7440-31-5 4.118 1.10 1.10 11007 11007 plating noble metal silver 7440-22-4 1.663 0.44 0.44 4446 4446 glue plastics epoxy resin - 0.626 0.17 1674 noble metal silver 7440-22-4 1.879 0.50 0.67 5022 6696 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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